High Density Packaging Technology

MCM: The High-Performance Electronic Packaging Technology

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

High Density Through Wafer Via Technology

The Through Silicon Via (TSV) process developed by Silex offers sub 50 μm pitch for through wafer connections in up to 600 μm thick substrates. Silex via process enables MEMS designs with significantly reduced die size and true "Wafer Level Packaging" features that are particularly important in consumer market applications. The TSV technology also enables integration of advanced interconnect fu...

High Temperature Electronics Packaging

Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...